The RCI-IIBEC Foundation and RCI Foundation Canada are pleased to announce that they will be providing funding for full-time college students to attend the 2026 IIBEC International Convention and Trade Show.
To qualify, an applicant must be a full-time student (at least 12 credit hours per semester) enrolled in architecture; architectural, structural, or civil engineering; construction management; building sciences or other related areas of study (ie. Trade school). Up to 25 students are eligible to receive this funding, possibly more, pending proximity to event. No more than three students from the same university may be selected and priority is given to first-time recipients.
The sponsorship includes IIBEC convention and trade show registration, four nights lodging (single occupancy) at the convention hotel, a stipend for meals, cost of travel up to $750 USD (receipts required), and a one-year IIBEC student membership.
As a sponsorship recipient, you will be expected to:
- Attend a minimum of ten hours of educational presentations and devote three hours to the tradeshow floor
- Interact informally with assigned host, staff, committees, and the Foundation Board of Directors during the
convention - Participate in marketing efforts by sharing your experience of the convention and the knowledge gained
- Attend Foundations Auction and Reception event on Sunday night, March 15.
- Please attach a current letter of recommendation from a professor or instructor.
- Include an essay explaining your interest in your field of study and what you hope to gain by attending the
IIBEC Building Enclosure Symposium (limit 150 words).
The application can be found here. The deadline for submitting the application and supporting documentation is Friday, January 16, 2026.
Please email Rick Gardner at Rgardner@iibec.org. You will be notified within a week or two of the application deadline if you have been awarded the sponsorship. For more information about student sponsorships, please contact Foundation Development Officer Rick Gardner.